Defects including die build‑up, surface bloom, delamination and silvery streaks often appear in PC components using polyether‑amide permanent antistatic masterbatch.
These problems are generally not triggered by excessive masterbatch addition. Main drivers are carrier‑PC incompatibility, thermal degradation, additive conflicts, improper screw shear and poor PC substrate condition (moisture, recycled material).
The antistatic polymer itself is non‑migrating; surface contaminants are degraded oligomers and additive complexes.
Reducing loading blindly may cause ESD failure while original defects persist. PC requires specially matched antistatic masterbatch carrier systems.
